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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/04/2005
Application #:
10651886
Filing Dt:
08/29/2003
Publication #:
Pub Dt:
07/01/2004
Inventor:
Ruei-Chih Chang
Title:
SUBSTRATE WITH STACKED VIAS AND FINE CIRCUITS THEREON, AND METHOD FOR FABRICATING THE SAME
Assignment: 1
Reel/Frame:
014471/0039Recorded: 08/29/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/16/2001
Assignee:
4914 LA GAMA WAY
SANTA BARBARA, CALIFORNIA 93111
Correspondent:
FULBRIGHT & JAWORSKI L.L.P.
ROBERT BERLINER
865 SOUTH FIGUEROA
TWENTY-NINTH FLOOR
LOS ANGELES, CA 90017-2571
Assignment: 2
Reel/Frame:
014471/0201Recorded: 08/29/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/05/2003
Assignee:
NO. 6, LI-HSIN ROAD
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN R.O.C.
Correspondent:
FULBRIGHT & JAWORSKI LLP.
M. JOHN CARSON
865 SOUTH FIGUEROA
TWENTY-NINTH FLOOR
LOS ANGELES, CA 90017-2571

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