Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10701061
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Filing Dt:
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11/04/2003
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Publication #:
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Pub Dt:
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07/08/2004
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Inventors:
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Hitoshi Arita, Akio Kojima
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Title:
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SOLDER ALLOY MATERIAL LAYER COMPOSITION, ELECTROCONDUCTIVE AND ADHESIVE COMPOSITION, FLUX MATERIAL LAYER COMPOSITION, SOLDER BALL TRANSFERRING SHEET, BUMP AND BUMP FORMING PROCESS, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6, NAKAMAGOME 1-CHOME |
| OHTA-KU |
| TOKYO 143-8555, JAPAN |
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| COOPER & DUNHAM LLP |
| IVAN S. KAVRUKOV, ESQ. |
| 1185 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036 |
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