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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/21/2006
Application #:
10687705
Filing Dt:
10/20/2003
Publication #:
Pub Dt:
07/08/2004
Inventors:
Masao Iwase, Soichi Nadahara
Title:
SEMICONDUCTOR WAFER AND A METHD FOR MANUFACTURING A SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
015097/0356Recorded: 03/17/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/18/2004
Exec Dt:
02/18/2004
Assignee:
1-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
FINNEGAN, HENDERSON , FARABOW ET AL.
ERNEST F. CHAPMAN
1300 I STREET, N.W.
WASHINGTON DC 20005-3315

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