Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10622357
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Filing Dt:
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07/17/2003
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Publication #:
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Pub Dt:
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07/15/2004
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Inventors:
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Hideo Kobayashi, Shinichi Shinohara, Hironobu Nishimura, Yukio Utsunomiya
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Title:
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Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18-1, TAKADA 1-CHOME, TOSHIMA-KU |
| TOKYO, JAPAN |
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| KOLISCH HARTWELL, P.C. |
| ANTON E. SKAUGSET |
| 520 S.W. YAMHILL STREET |
| STE. 200 |
| PORTLAND, OR 97204 |
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