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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
10744691
Filing Dt:
12/23/2003
Publication #:
Pub Dt:
07/15/2004
Inventors:
Steven William Webb, Mandar Shyam Mudhikar
Title:
Multi-resinous molded articles having integrally bonded graded interfaces
Assignment: 1
Reel/Frame:
014853/0711Recorded: 12/23/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/22/2003
Exec Dt:
12/22/2003
Assignee:
GESM - LEGAL 130335-3 60SD
ONE PLASTICS AVE.
PITTSFIELD, MASSACHUSETTS 01201-3697
Correspondent:
GENERAL ELECTRIC COMPANY
GESM LEGAL 130335-3 SD
ONE PLASTICS AVE.
PITTSFIELD, MA 01201-3697
Assignment: 2
Reel/Frame:
015961/0344Recorded: 11/08/2004Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/13/2004
Assignee:
187 DANBURY ROAD
SECOND FLOOR
WILTON, CONNECTICUT 06897
Correspondent:
JAMES M. SINGER
PEPPER HAMILTON LLP
50TH FLOOR
500 GRANT STREET
PITTSBURGH, PA 15219-2502
Assignment: 3
Reel/Frame:
016386/0643Recorded: 08/12/2005Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/13/2004
Assignee:
6325 HUNTLEY ROAD
WORTHINGTON, OHIO 43085
Correspondent:
JAMES M. SINGER
500 GRANT STREET, 50TH FLOOR
PITTSBURGH, PA 15219

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