Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10376526
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Filing Dt:
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02/27/2003
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Publication #:
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Pub Dt:
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07/22/2004
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Inventors:
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Tadashi Takemoto, Takashi Nagase, Takashi Uetani, Morio Yamazaki
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Title:
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Solder composition substantially free of lead
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-5, SHIOKUSA, 2-CHOME, NANIWA-KU |
OSAKA, JAPAN |
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SQUIRE, SANDERS & DEMPSEY L.L.P. |
SUNG I. OH |
801 SOUTH FIGUEROA STREET |
14TH FLOOR |
LOS ANGELES, CALIFORNIA 90017-5554 |
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