Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10632953
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Filing Dt:
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08/04/2003
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Publication #:
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Pub Dt:
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07/29/2004
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Inventors:
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Takayuki Shoya, Masaru Nagano
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Title:
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Semiconductor wafer processing apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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| LEYDIG, VOIT & MAYER |
| JEFFREY A. WYAND |
| 700 THIRTEENTH ST., N.W. |
| SUITE 300 |
| WASHINGTON, D.C. 20005-3960 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-6334 |
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| LEYDIG, VOIT & MAYER |
| JEFFREY A. WYAND |
| 700 13TH ST., N.W. SUITE 300 |
| WASHINGTON, D.C. 20005-3960 |
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