Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/13/2005
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Application #:
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10747076
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Inventor:
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Masaharu Yamamoto
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Title:
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SOLDER BUMP TRANSFER SHEET, METHOD FOR PRODUCING THE SAME, AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE AND PRINTED BOARD
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 4-7-19, KITAHAMA, CHUO-KU |
| OSAKA-SHI, OSAKA, JAPAN 541-0041 |
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| JEFFREY L. COSTELLIA |
| NIXON PEABODY LLP |
| 401 9TH STREET, N.W. |
| SUITE 900 |
| WASHINGTON, DC 20004-2128 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 4-7-19, KITAHAMA, CHUO-KU |
| OSAKA-SHI, OSAKA, JAPAN 541-0041 |
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| JEFFREY L. COSTELLIA |
| NIXON PEABODY LLP |
| SUITE 900 |
| 401 9TH STREET, N.W. |
| WASHINGTON, DC 20004-2128 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-19-1, MINAMISUITA |
| SUITA-SHI, OSAKA, JAPAN 564-0043 |
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| JEFFREY L. COSTELLIA |
| NIXON PEABODY LLP |
| SUITE 900 |
| 401 9TH STREET, N.W. |
| WASHINGTON, D.C. 20004-2128 |
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