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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10721225
Filing Dt:
11/26/2003
Publication #:
Pub Dt:
08/05/2004
Inventors:
Joern Luetzen, Albert Birner, Stephan Kudelka, Helmut Tews, Rolf Weis
Title:
METHOD AND STRUCTURES FOR INCREASING THE STRUCTURE DENSITY AND THE STORAGE CAPACITANCE IN A SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
015594/0775Recorded: 01/13/2005Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/27/2004
Exec Dt:
01/03/2005
Exec Dt:
01/05/2005
Exec Dt:
12/25/2004
Exec Dt:
12/24/2004
Assignee:
ST.-MARTIN-STRASSE 53
MUENCHEN, GERMANY 81669
Correspondent:
SLATER & MATSIL, L.L.P.
IRA S. MATSIL
17950 PRESTON RD.
SUITE 1000
DALLAS, TX 75252-5793
Assignment: 2
Reel/Frame:
023821/0535Recorded: 01/15/2010Pages: 393
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/25/2006
Assignee:
GUSTAV-HEINEMANN-RING 212
MUNICH, GERMANY 81739
Correspondent:
JONATHAN BOCKMAN
C/O MORRISON AND FOERSTER LLP
1650 TYSONS BLVD. SUITE 400
MCLEAN, VA 22102

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