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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10771451
Filing Dt:
02/05/2004
Publication #:
Pub Dt:
08/12/2004
Inventors:
Shinichi Miyazaki, Hirokazu Honda, Kenji Ooyachi
Title:
Method of forming a connecting conductor and wirings of a semiconductor chip
Assignment: 1
Reel/Frame:
014966/0602Recorded: 02/05/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2004
Exec Dt:
01/28/2004
Exec Dt:
01/28/2004
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI
KANAGAWA 211-8668, JAPAN
Correspondent:
DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
STEVEN J. WEISBURB
1177 AVENUE OF THE AMERICAS
41ST FLOOR
NEW YORK, NY 10036-2714

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