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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10746126
Filing Dt:
12/24/2003
Publication #:
20040154926
Pub Dt:
08/12/2004
Inventors:
Zhi-Wen Sun, Bo Zheng, Nicolay Y. Kovarsky, You Wang, Toshiyuki Nakagawa, Terukazu Aitani et al
Title:
Multiple chemistry electrochemical plating method
Assignment: 1
Reel/Frame:
014520/0407Recorded: 04/14/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SUN, ZHI-WEN
Exec Dt:
02/18/2004
ZHENG, BO
Exec Dt:
02/18/2004
KOVARSKY, NICOLAY Y.
Exec Dt:
02/18/2004
WANG, YOU
Exec Dt:
02/18/2004
NAKAGAWA, TOSHIYUKI
Exec Dt:
01/19/2004
AITANI, TERUKAZU
Exec Dt:
01/19/2004
HARA, KOJI
Exec Dt:
01/19/2004
MAO, DAXIN
Exec Dt:
01/19/2004
YANG, MICHAEL
Exec Dt:
02/18/2004
Assignee:
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
APPLIED MATERIALS, INC.
ROBERT W. MULCAHY
P.O. BOX 1450
SANTA CLARA, CA 95052

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