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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/26/2005
Application #:
10722163
Filing Dt:
11/25/2003
Publication #:
Pub Dt:
08/12/2004
Inventors:
Daisuke Nakamura, Takeshi Aota
Title:
HEAT DISSIPATING STRUCTURE OF PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
Assignment: 1
Reel/Frame:
014749/0470Recorded: 11/25/2003Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/30/2003
Exec Dt:
10/30/2003
Assignee:
3-10, YOKOYAMA-CHO
NIHONBASHI, CHUO-KU
TOKYO-TO, JAPAN
Correspondent:
WARE, FRESSOLA, VAN DER SLUYS, ET AL.
FRANCIS J. MAGUIRE
755 MAIN ST., P.O. BOX 224
MONROE, CT 06468

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