Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/19/2006
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Application #:
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10774155
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Filing Dt:
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02/05/2004
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Publication #:
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Pub Dt:
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08/12/2004
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Inventors:
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Rahul N. Manepalli, Saravanan Krishnan, Choong Kooi Chee
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Title:
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UNDERFILLING PROCESS IN A MOLDED MATRIX ARRAY PACKAGE USING FLOW FRONT MODIFYING SOLDER RESIST
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY SOKOLOFF TAYLOR, ET AL. |
| 12400 WILSHIRE BOULEVARD |
| 7TH FLOOR |
| LOS ANGELES, CA 90025 |
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