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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10473561
Filing Dt:
04/05/2004
Publication #:
Pub Dt:
08/12/2004
Inventors:
Takashi Sugino, Masaki Kusuhara, Masaru Umeda
Title:
Deposition method, deposition apparatus, insulating film and semiconductor integrated circuit
Assignment: 1
Reel/Frame:
015231/0296Recorded: 04/19/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/29/2004
Exec Dt:
03/29/2004
Exec Dt:
03/29/2004
Assignees:
2-16, NIHONBASHI-MUROMACHI 4-CHOME
CHUO-KU, TOKYO, JAPAN 103-0022
4-1-322, KAMISHINADEN 3-CHOME
TOYONAKA-SHI, OSAKA, JAPAN 560-0085
Correspondent:
RANDALL J. KNUTH, P.C.
3510-A STELLHORN ROAD
FORT WAYNE, IN 46815-4631

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