Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/23/2007
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Application #:
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10756763
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Filing Dt:
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01/14/2004
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Publication #:
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Pub Dt:
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08/19/2004
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Inventors:
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Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi, Toshinori Koyama
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Title:
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AN ELECTRONIC PARTS PACKAGING STRUCTURE IN WHICH A SEMICONDUCTOR CHIP IS MOUNTED ON A WIRING SUBSTRATE AND BURIED IN AN INSULATION FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI, |
| NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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| ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO |
| 1725 K STREET, NW |
| SUITE 1000 |
| WASHINGTON, DC 20006 |
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Assignment:
2
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RE-RECORD TO CORRECT THE RECEIVING PARTY PREVIOUSLY RECORDED AT R/F 14573/92
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| 80, OSHIMADA-MACHI, NAGANO-SHI |
| NAGANO, JAPAN 381-2287 |
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| KRATZ, QUINTOS & HANSON, LLP |
| 1420 K STREET, NW, SUITE 400 |
| WASHINGTON, DC 20005 |
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