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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
04/19/2005
Application #:
10738863
Filing Dt:
12/16/2003
Publication #:
Pub Dt:
08/19/2004
Inventors:
Makoto Tsutsui, Toshihisa Nagasawa
Title:
CHIP-TYPE CAPACITOR, METHOD OF MANUFACTURING THE SAME AND MOLDING DIE
Assignment: 1
Reel/Frame:
014821/0349Recorded: 12/16/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/02/2003
Exec Dt:
12/02/2003
Assignees:
7-1, KORIYAMA 6-CHOME,
TAIHAKU-KU, SENDAI-SHI
MIYAGI, JAPAN
560, NYUZEN, NYUZEN-MACHI
SHIMONIKAWA-GUN, TOYAMA, JAPAN
Correspondent:
FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C.
DOUGLAS HOLTZ
767 THIRD AVENUE
25TH FLOOR
NEW YORK, NEW YORK 10017-2023
Assignment: 2
Reel/Frame:
042744/0462Recorded: 06/19/2017Pages: 12
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/26/2006
Assignee:
6-7-1, KOHRIYAMA, TAIHAKU-KU
SENDAI-SHI
MIYAGI, JAPAN
Correspondent:
MCCOY RUSSELL LLP
806 SW BROADWAY
SUITE 600
PORTLAND, OR 97205
Assignment: 3
Reel/Frame:
043125/0221Recorded: 07/07/2017Pages: 14
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/19/2017
Assignee:
7-1, KOHRIYAMA 6-CHOME
TAIHAKU-KU, SENDAI-SHI
MIYAGI, JAPAN
Correspondent:
MCCOY RUSSELL LLP
806 SW BROADWAY
SUITE 600
PORTLAND, OR 97205

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