Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/27/2005
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Application #:
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10773220
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Filing Dt:
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02/09/2004
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Publication #:
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Pub Dt:
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08/19/2004
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Inventors:
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Shin Takanezawa, Koji Morita, Takako Watanabe, Toshihisa Kumakura, Hiroyuki Fukai et al
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Title:
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METHOD FOR PREPARING AN INSULATING RESIN COMPOSITION, INSULATING RESIN COMPOSITION, MULTILAYER WIRING BOARD AND PROCESS FOR PRODUCING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-1, NISHI-SHINJUKU 2-CHOME |
SHINJUKU-KU, TOKYO, JAPAN |
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JOERG-UWE SZIPL, ESQ. |
2300 NINTH STREET, SOUTH SUITE PH-1 |
ARLINGTON, VA 22204-2320 |
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