Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10785685
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Filing Dt:
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02/23/2004
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Publication #:
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Pub Dt:
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08/26/2004
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Inventor:
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Atsushi Osawa
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Title:
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Substrate treating method and apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1 TENJINKITAMACHI TERANOUCHI-AGARU |
| 4-CHOME HORIKAWA-DORI |
| KAMIKYO-KU, KYOTO 602-8585, JAPAN |
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| OSTROLENK, FABER, GERB & SOFFEN, LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
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