Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10795950
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Filing Dt:
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03/08/2004
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Publication #:
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Pub Dt:
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09/02/2004
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Inventor:
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Tue Nguyen
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Title:
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MULTILAYER COPPER STRUCTURE FOR IMPROVING ADHESION PROPERTY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2201 S. MCDOWELL BOULEVARD |
| PETALUMA, CALIFORNIA 94954 |
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| TUE NGUYEN |
| 496 OLIVE AVE. |
| FREMONT, CA 94539 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 44 MONTGOMERY STREET |
| SUITE 800 |
| SAN FRANCISCO, CALIFORNIA 94104-4811 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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