Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10382560
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Filing Dt:
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03/05/2003
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Publication #:
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Pub Dt:
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09/09/2004
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Inventor:
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Hyeon-Seag Kim
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Title:
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Interconnect structure having improved stress migration reliability
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE AMD PLACE |
| P.O. BOX 3453 |
| SUNNYVALE, CALIFORNIA 94088-3453 |
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| FARJAMI & FARJAMI LLP |
| MICHAEL FARJAMI, ESQ. |
| 16148 SAN CANYON |
| IRVINE, CA 92618 |
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