Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10739536
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Filing Dt:
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12/19/2003
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Publication #:
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Pub Dt:
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09/09/2004
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Inventors:
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Makoto Ito, Takeshi Sekiguchi, Sousaku Sawada
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Title:
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Semiconductor apparatus having system-in-package arrangement with improved heat dissipation
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-33, KITAHAMA 4-CHOME, CHUO-KU |
OSAKA-SHI, OSAKA 541-0041, JAPAN |
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SMITH, GAMBRELL & RUSSELL |
1850 M STREET, N.W., SUITE 800 |
WASHINGTON, D.C. 20036 |
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