Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10478682
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Filing Dt:
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12/05/2003
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Publication #:
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Pub Dt:
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09/09/2004
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Inventors:
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Andreas Woerz, Thomas Zeiler
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Title:
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Plastic housing comprising several semiconductor chips and a wiring modification plate, and method for producing the plastic housing in an injection-molding mold
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST.-MARTIN STR. 53 |
| 81669 MUNICH, GERMANY |
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| EDELL, SHAPIRO & FINNAN LLC |
| PATRICK J. FINNAN |
| 1901 RESEARCH BLVD. |
| SUITE 400 |
| ROCKVILLE, MD 20850 |
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