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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10485153
Filing Dt:
01/29/2004
Publication #:
Pub Dt:
09/16/2004
Inventors:
Akihisa Murata, Toshiyuki Oshima, Yukio Arimitsu, Kazuyuki Kiuchi, Masaaki Sato et al
Title:
Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit board
Assignment: 1
Reel/Frame:
015367/0773Recorded: 01/29/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/20/2004
Exec Dt:
01/20/2004
Exec Dt:
01/20/2004
Exec Dt:
01/20/2004
Exec Dt:
01/20/2004
Exec Dt:
01/20/2004
Assignee:
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI
OSAKA 567-8680, JAPAN
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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