Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/05/2007
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Application #:
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10810719
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Filing Dt:
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03/29/2004
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Publication #:
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Pub Dt:
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09/16/2004
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Inventors:
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Panayotis C. Andricacos, Steven H. Boettcher, Dean S. Chung, Hariklia Deligianni et al
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Title:
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ELECTROPLATED COPPER INTERCONNECTION STRUCTURE, PROCESS FOR MAKING AND ELECTROPLATING BATH
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Assignment:
1
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FIRST AMENDMENT TO PATENT SECURITY AGREEMENT
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| 3003 TASMAN DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| BRANDIE SULLIVAN |
| 1025 VERMONT AVE. NW, SUITE 1130 |
| NATIONAL CORPORATE RESEARCH, LTD. |
| WASHINGTON, DC 20005 |
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