Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10808502
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Filing Dt:
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03/25/2004
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Publication #:
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Pub Dt:
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09/16/2004
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Inventors:
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Takehito Tsukamoto, Hiroshi Matsuzawa, Satoshi Akimoto, Masataka Maehara et al
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Title:
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Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, TAITO 1-CHOME |
| TAITO-KU, TOKYO 110-0016, JAPAN |
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| STAAS & HALSEY LLP |
| ATTENTION: DAVID M. PITCHER |
| 1201 NEW YORK AVENUE, N.W. |
| SUITE 700 |
| WASHINGTON, D.C. 20005 |
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