Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/14/2006
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Application #:
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10483613
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Filing Dt:
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01/14/2004
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Publication #:
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Pub Dt:
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09/16/2004
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Inventors:
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Hiroji Aga, Hiroyuki Takahashi, Kiyoshi Mitani
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Title:
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SOI WAFER PRODUCING METHOD, AND WAFER SEPARATING JIG
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1393, OAZA YASHIRO |
| CHIKUMA-SHI, NAGANO, JAPAN 387-8555 |
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| RONALD R. SNIDER |
| P.O. BOX 27613 |
| WASHINGTON, DC 20038-7613 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO 100-0005, JAPAN |
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| SNIDER & ASSOCIATES |
| RONALD R. SNIDER |
| P.O. BOX 27613 |
| WASHINGTON, D.C. 20038-7613 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-0005 |
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| SNIDER & ASSOCIATES |
| RONALD R. SNIDER |
| P.O. BOX 27613 |
| WASHINGTON, D.C. 20038-7613 |
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