Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/07/2006
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Application #:
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10775395
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Filing Dt:
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02/10/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Inventors:
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Philip Deane, Neil Teitelbaum
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Title:
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SOLDER BONDING TECHNIQUE FOR ASSEMBLING A TILTED CHIP OR SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1768 AUTOMATION PARKWAY |
| SAN JOSE, CALIFORNIA 95131 |
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| 3000 MERIVALE ROAD |
| OTTAWA, ONTARIO, CANADA K2G 6N7 |
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| ALLEN, DYER, DOPPELT, ET AL. |
| CHARLES E. WANDS |
| 1901 S. HARBOR CITY BLVD. |
| SUITE 507 |
| MELBOURNE, FL 32901 |
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