Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10404397
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Filing Dt:
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03/31/2003
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Publication #:
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Pub Dt:
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09/30/2004
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Inventors:
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Ing-Jer Chiou, Hsi-Chi Chien
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Title:
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Heat-dissipation module for chip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2FL., NO. 327, SUNG LUNG ROAD |
| TAIPEI, TAIWAN R.O.C. |
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| HAVERSTOCK & OWENS LLP |
| JONATHAN O. OWENS |
| 162 NORTH WOLFE ROAD |
| SUNNYVALE, CA 94086 |
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