Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/14/2006
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Application #:
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10796004
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Filing Dt:
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03/10/2004
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Publication #:
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Pub Dt:
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09/30/2004
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Inventors:
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Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi
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Title:
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METHOD OF PRODUCTION OF MULTILAYER CIRCUIT BOARD WITH BUILT-IN SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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80 OSHIMADA-MACHI |
NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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STAAS & HALSEY LLP |
H.J. STAAS |
1201 NEW YORK AVENUE, NW |
SUITE 700 |
WASHINGTON, DC 20005 |
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