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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/24/2007
Application #:
10808567
Filing Dt:
03/25/2004
Publication #:
Pub Dt:
10/07/2004
Inventors:
Shoji Miura, Yoshimi Nakase
Title:
MOLDED SEMICONDUCTOR DEVICE WITH HEAT CONDUCTING MEMBERS
Assignment: 1
Reel/Frame:
015152/0974Recorded: 03/25/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/22/2004
Exec Dt:
03/22/2004
Assignee:
1-1, SHOWA-CHO
KARIYA-CITY, ALCHI-PREF, JAPAN 448-8661
Correspondent:
POSZ & BETHARDS, PLC
DAVID G. POSZ
11250 ROGER BACON DRIVE, SUITE 10
RESTON, VA 20190

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