Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/25/2006
|
Application #:
|
10781876
|
Filing Dt:
|
02/20/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2004
| | | | |
|
Inventor:
|
Cheng-Cheng Liu
|
|
Title:
|
MULTI-CHIP PACKAGE COMBINING WIRE-BONDING AND FLIP-CHIP CONFIGURATION
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, R.O.C., TAIWAN |
|
|
|
|
| TROXELL LAW OFFICE PLLC |
| BRUCE H. TROXELL |
| 5205 LEESBURG PIKE |
| SUITE 1404 |
| FALLS CHURCH, VIRGINIA 22041-3401 |
|
|
Search Results as of:
06/17/2024 11:08 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
