Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10820123
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Filing Dt:
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04/08/2004
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Publication #:
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Pub Dt:
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10/14/2004
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Inventors:
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Yukio Hosaka, Hiroshi Shiho, Kou Hasegawa, Nobuo Kawahashi
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Title:
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Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6-10, TSUKIJI 5-CHOME, CHUO-KU |
TOKYO, JAPAN 104-0045 |
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OBLON, SPIVAK, MCCLELLAND, ET AL. |
ROLAND E. MARTIN |
1940 DUKE STREET |
ALEXANDRIA, VIRGINIA 22314 |
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