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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/08/2008
Application #:
10728991
Filing Dt:
12/08/2003
Publication #:
Pub Dt:
10/14/2004
Inventors:
Haruhisa Masuda, Hiromichi Nakata, Eiji Nakamura, Toshiyuki Zento, Isamu Okamoto et al
Title:
THERMOPLASTIC POLYMER COMPOSITION, MOLDED PRODUCT, AND MULTILAYER STRUCTURE
Assignment: 1
Reel/Frame:
015194/0627Recorded: 04/09/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/16/2003
Exec Dt:
07/22/2003
Exec Dt:
11/19/2003
Exec Dt:
11/19/2003
Exec Dt:
11/19/2003
Exec Dt:
11/19/2003
Assignee:
1621, SAKAZU, KURASHIKI-SHI
OKAYAMA, JAPAN 710-8622
Correspondent:
RON WARREN & SCOTT SOFINOWSKI
15800 YEOHO RD.
SPARKS, MD 21152

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