Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10759801
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Filing Dt:
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01/16/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Inventors:
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Hongwen Li, Lee Luo, Ilias Iliopoulos, Michael D. Armacost
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Title:
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Integrated equipment set for forming a low K dielectric interconnect on a substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| APPLIED MATERIALS, INC. |
| ROBERT W. MULCAHY |
| P.O. BOX 1450 |
| SANTA CLARA, CA 95052 |
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