Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10417705
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Filing Dt:
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04/17/2003
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Publication #:
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Pub Dt:
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10/21/2004
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Inventors:
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Sey-Shing Sun, Byung-Sung Kwak, Jayanthi Pallinti, William Barth
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Title:
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Method of fabricating an alloy cap layer over CU wires to improve electromigration performance of CU interconnects
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1551 MCCARTHY BLVD. |
| MILPITAS, CALIFORNIA 95035 |
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| LSI LOGIC CORPORATION |
| TIMOTHY R. CROLL |
| 1551 MCCARTHY BLVD. |
| MILPITAS, CA 95035 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1621 BARBER LANE |
| MILPITAS, CALIFORNIA 95035 |
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| PETER P. SCOTT |
| 4420 ARROWSWEST DR |
| MS L-203 |
| COLORADO SPRINGS, CO 80907 |
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