Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10841086
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Filing Dt:
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05/07/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Inventors:
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Ming Xi, Paul Frederick Smith, Ling Chen, Michael X. Yang, Mei Chang, Fusen Chen et al
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Title:
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Process for filing a via and trench using multiple barrier and a conductive material
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 450-A |
| SANTA CLARA, CALIFORNIA 95052 |
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| APPLIED MATERIALS INC. |
| PATENT COUNSEL |
| PO BOX 450-A |
| SANTA CLARA, CA 95052 |
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