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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10777089
Filing Dt:
02/13/2004
Publication #:
Pub Dt:
11/04/2004
Inventors:
Yasuaki Tsuchiya, Toshiji Taiji, Tetsuyuki Itakura, Shin Sakurai, Kenichi Aoyagi et al
Title:
Chemical mechanical polishing slurry
Assignment: 1
Reel/Frame:
015532/0150Recorded: 07/02/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/09/2004
Exec Dt:
06/09/2004
Exec Dt:
06/09/2004
Exec Dt:
06/09/2004
Exec Dt:
06/09/2004
Exec Dt:
06/09/2004
Assignees:
1753 SHIMONUMABE, NAKAHARA-KU KAWASAKI
KANAGAWA, JAPAN 211-8668
5-1, TAITO 1-CHOME, TAITO-KU
TOKYO, JAPAN
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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