Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10824223
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Filing Dt:
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04/14/2004
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Publication #:
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Pub Dt:
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11/04/2004
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Inventors:
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Wen-Yen Lin, Tsan-Nan Chien
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Title:
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Function module with built-in plate-type heat dissipation device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 188, WEN HWA 2ND RD., KUEI SHAN HSIANG |
| TAO YUAN SHIEN, TAIWAN R.O.C. |
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| THOMAS KAYDEN HORSTEMEYER ET.AL. |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GA 30339-5948 |
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