Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10486169
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Filing Dt:
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02/04/2004
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Publication #:
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Pub Dt:
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11/04/2004
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Inventors:
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Hideo Honma, Atsushi Kawahara, Akira Teranishi
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Title:
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METHOD OF PLATING NONCONDUCTOR PRODUCT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-4-1, IKEDA-CHO |
| YOKOSUKA-SHI, KANAGAWA, JAPAN 239-0806 |
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| 1-50-1, MUTSUURAHIGASHI, KANAZAWA-KU, |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 236-8501 |
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| 1, TOYOTA-CHO |
| TOYOTA-SHI, AICHI, JAPAN 471-8571 |
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| TERRYENCE F. CHAPMAN |
| 2026 RAMBLING ROAD |
| KALAMAZOO, MI 49008-1631 |
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