Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10826091
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Filing Dt:
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04/16/2004
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Publication #:
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Pub Dt:
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11/04/2004
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Inventors:
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Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Naomi Kanda, Toshiko Nakagawa
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Title:
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BONDING LAYER FORMING SOLUTION, METHOD OF PRODUCING COPPER-TO-RESIN BONDING LAYER USING THE SOLUTION, AND LAYERED PRODUCT OBTAINED THEREBY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, HIGASHIHATSUSHIMA-CHO |
| AMAGASAKI-SHI |
| HYOGO 660-0832, JAPAN |
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| DOUGLAS P. MUELLER |
| MERCHANT & GOULD P.C. |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402-0903 |
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