Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2005
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Application #:
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10838351
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Filing Dt:
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05/05/2004
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Publication #:
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Pub Dt:
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11/11/2004
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Inventors:
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Bau-Nan Lee, Cheng-Fen Chen, Chih-Wei Tsai, Chih-Pin Hung
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Title:
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MULTI-CHIP PACKAGE WITH ELECTRICAL INTERCONNECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD RD., NANTZE EXPORT |
| PROCESSING ZONE, KAOHSIUNG, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| BRUCE H. TROXELL |
| 5205 LEESBURG PIKE |
| STE. 1404 |
| FALLS CHURCH, VA 22041-3401 |
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