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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10786819
Filing Dt:
02/25/2004
Publication #:
Pub Dt:
11/11/2004
Inventors:
Belgacem Haba, Yoichi Kubota
Title:
Ball grid array with bumps
Assignment: 1
Reel/Frame:
014816/0026Recorded: 07/02/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/22/2004
Exec Dt:
06/22/2004
Assignee:
3099 ORCHARD DRIVE
SAN JOSE, CALIFORNIA 95134
Correspondent:
LERNER, DAVID, LITTENBERG, ET AL.
MARCUS J. MILLET
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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