Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10814600
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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11/11/2004
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Inventors:
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Hiromitsu Kobayashi, Masahiro Miyashita, Hidetoshi Tatebe, Makoto Kifune
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Title:
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Mold clamping apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4963-3, OHAZAMINAMIJO, |
| SAKAKIMACHI, HANISHINA-GUN |
| NAGANO-KEN, JAPAN |
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| WEINGARTEN, SCHURGIN ET AL. |
| CHARLES L. GAGNEBIN, III |
| TEN POST OFFICE SQUARE |
| BOSTON, MA 02109 |
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