Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10827447
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Filing Dt:
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04/20/2004
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Publication #:
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Pub Dt:
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11/11/2004
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Inventors:
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Hiromi Aoi, Hiroshi Shiho, Nobuo Kawahashi, Kou Hasegawa
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Title:
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Polishing pad and method of polishing a semiconductor wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-10, TSUKIJI 5-CHOME, CHUO-KU |
| TOKYO 104-0045, JAPAN |
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| OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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