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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10794085
Filing Dt:
03/08/2004
Publication #:
Pub Dt:
11/18/2004
Inventors:
Jong-sig Lee, Gi-tae Mun, Jae-cheol Lee
Title:
In-situ monitoring system for bonding process and method therefor
Assignment: 1
Reel/Frame:
015068/0344Recorded: 03/08/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/03/2004
Exec Dt:
03/03/2004
Exec Dt:
03/03/2004
Assignee:
416, MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
DOANE, SWECKER & MATHIS, L.L.P
CHARLES F. WIELAND III
P.O. BOX 1404
ALEXANDRIA, VA 22313-1404

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