Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10443418
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Filing Dt:
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05/22/2003
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Publication #:
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Pub Dt:
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11/25/2004
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Inventor:
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Chao-Yuan Su
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Title:
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Flip chip assembly process and substrate used therewith
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 121, PARK AVE. III, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU 300, TAIWAN R.O.C. |
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| THOMAS, KAYDEN, HORSTEMEYER & RISLEY LLP |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GA 30339-5948 |
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