Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10478454
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Filing Dt:
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11/21/2003
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Publication #:
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Pub Dt:
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11/25/2004
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Inventors:
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Keiichiro Oishi, Isao Sasaki, Junichi Otani
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Title:
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High-strength copper alloy
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8-374, SAMBO-CHO, SAKAI-SHI |
| OSAKA 590-0906, JAPAN |
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| KODA & ANDROLIA |
| WILLIAM L. ANDROLIA |
| 2029 CENTURY PARK EAST |
| SUITE 1430 |
| LOS ANGELES, CA 90067-3024 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 7-35, 4-CHOME, KITA-SHINAGAWA |
| SHINAGAWA-KU, TOKYO, JAPAN |
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| WILLIAM L. ANDROLIA |
| 1999 AVENUE OF THE STARS, SUITE 400 |
| LOS ANGELES, CA 90067 |
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