Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/06/2008
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Application #:
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10789914
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Filing Dt:
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02/27/2004
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Publication #:
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Pub Dt:
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11/25/2004
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Inventors:
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Takeshi Hosomi, Masako Yamashita, Takayuki Baba, Kentaro Yabuki
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Title:
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RESIN COMPOSITION, PREPREG, LAMINATE, AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN |
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| HARNESS, DICKEY & PIERCE., P.L.C. |
| ROBERT M. SIMINSKI |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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