Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10606326
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Filing Dt:
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06/26/2003
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Publication #:
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Pub Dt:
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12/02/2004
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Inventors:
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Shinji Yuri, Tomoe Suzuki, Kazuhisa Sato, Kozo Yamazaki
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Title:
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Multilayer wiring board, method of manufacturing the wiring board and substrate material for the wiring board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-18 TAKATSUJI-CHO, MIZUHO-KU |
| NAGOYA-SHI, AICHI 467-8525, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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