Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/09/2007
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Application #:
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10839283
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Filing Dt:
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05/06/2004
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Publication #:
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Pub Dt:
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12/02/2004
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Inventor:
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Atsushi Saito
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Title:
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METHOD OF MOUNTING ELECTRONIC COMPONENT, STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MODULE, AND ELECTRONIC APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU |
| TOKYO, JAPAN 163-0811 |
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| OLIFF & BERRIDGE, PLC |
| JAMES A. OLIFF |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 40TH FLOOR, JARDINE HOUSE1 CONNAUGHT PLACE |
| CENTRAL HONG KONG, CHINA |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.10, JIUXIANQIAO RD., CHAOYANG |
| BEIJING, CHINA |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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